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Surface Treatment Business Division

Comprehensive support for surface treatment businesses

The Surface Treatment Business Division makes surface treatment agents, offering plating agents for electroless plating processes, electroplating, precious metal plating, functional surface treatment and others according to various applications for semiconductors, electronic components, printed wiring boards, and decorative things. We respond in a timely way to a wide range of needs in Japan and overseas, drawing on the JX Mining & Metals Group’s overseas bases to provide technology and local response, including inventory management (mainly in Southeast Asia) in cooperation with our home operations (at the Takatsuki plant).

We meet customer needs through development, testing, and analysis

As a product development-oriented manufacturer, we concentrate on development of new surface treatment agents. Drawing on long experience and accumulated test data, we are able to offer highly customized or entirely new products. Product development skills and strong support capabilities—including testing, analysis using evaluation equipment, and dispatch of technical assistants—allow us to respond to customer needs.

Examples of plating products in use (Au/Ni, thick plated Ni, electroless Sn etc.)

Solutions proposals based on four insights

Solutions proposals based on four insights

Takatsuki Plant (Osaka)

The Takatsuki Plant is our base for surface treatment production and research and development. It is the hub of a production system that ensures a high level of reliability and advanced assessment and analysis.

Assessment & analysis equipment at Takatsuki Plant

Surface (cross-section) monitoring equipment

  • Field-emission-type scanning electron microscope (Hitachi, SU-8020)
  • Ion-sputter coating machine (Hitachi, E101)
  • Energy-dispersive X-ray analyzer (HORIBA, XMAX-370)
  • XPS X-ray photoelectron spectrometer (ULVAC-PHI, PHI5000 Versa Probe III)
  • Confocal microscope (Lasertec, C130)
  • Cross section polisher (JEOL, IB-19500CP)

Concentration analysis equipment

  • ICP high-frequency plasma emission spectrometer
    (Agilent 5110 ICP-OES, SII SPS-3500-DD)
  • Atomic absorption spectrometer (Thermo Electron, iCE3300)
  • UV and visible-spectrum spectrophotometer (Shimadzu, UV-2600)
  • High-performance liquid chromatograph (Nippon Waters, ACQUITY)
    Capillary electrophoresis analyzer (Otsuka Electronics, CAPI-3200)
  • Total organic carbon analyzer (Shimadzu, TOC-V)
  • Fourier-transform infrared spectrophotometer (JASCO, FT-IR4600)
  • Gas chromatograph (Agilent, 7890B)

Other experimental equipment

  • Bondtester (Dage, Series4000)
  • Solder reflow oven (Japan Pulse, RF-330)
  • Solder checker (Rhesca, SAT-5100)
  • Wire bonder (K&S, 4700AD)
  • X-ray fluorescence coating thickness-measuring instrument (Fischer, X-RAY XDV-μ)
  • Dynamic ultramicro hardness tester (Shimadzu, DUH-200)
  • Salt spray/CASS test instrument (Suga Test Instruments, STP-90)
  • Constant temperature and constant humidity monitor (Nagano Science, LH33-12M)
  • MIT-type folding endurance tester (Yasuda Seiki Seisakusho, No. 307 DW-1)
  • Precision universal tester (Shimadzu, AGS-X)
  • Electrical contact simulator (Yamazaki Seiki Seisakusho, CRS-1)
  • Others
Special Website for Surface Treatment
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